Patent pending technology for connectors and cabling - EV, Electrification, Data Centers, and more...
Patent pending technology for connectors and cabling - EV, Electrification, Data Centers, and more...
We have a unique, patent-pending forced convection and multi-phase, multi-constituent dielectric fluid and boiling heat transfer cooling method for cables and connectors allowing for up to several MW of capacity that does not involve water, oil, or other presently used liquids / existing processes. Our patent-pending technology controls the thermodynamics of heat transfer, and the interrelationships between temperature, pressure, and the boundary between liquid and gaseous phases.
This very consistent temperature regulation will, in turn, significantly help the derating curves for cables, thereby keeps cable sizes much smaller and at more manageable diameters, even at high currents and power levels for various applications in energy, smart infrastructure, and electrification. Our control mechanism can take into account both the ambient temperature, the maximum operating temperature, and the cooling required resulting in the best possible derating curve with minimal drop off in current carrying capacity as a function of temperature.
To enhance high power applications within many verticals, we have a passive cooling material that reduces contact resistance between plug and socket components and could help with fretting wear reduction as well. This conductive paste is comprised of various nanomaterials and provides both enhanced conductivity as well as friction reduction.
Cambridge, Massachusetts, United States
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Carbon Kinetics
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